Home > Product > Concrete Grinding and Polishing Tools > HTC Floor Grinding Pad > Resin bond diamond grinding plate
Resin bond diamond grinding plateResin bond diamond grinding plateResin bond diamond grinding plateResin bond diamond grinding plate

Resin bond diamond grinding plate

  • Model Number: BW-RBDGD
  • Segment Material:Resin or diamond
  • Segment Number: 5
  • Segment Shape: Cylinder
  • Normal Grit:  50#,100#,200#,400#,800#,1500#,3000#
  • Machine: Floor grinding machine
  • Industry: Diamond grinding tools
  • Grinding Result: High gloss and smooth
  • Advantage: Good sharpness and long lifespan.
  • Applications: Resin bond diamond grinding plates are applicated for concrete,terrazzo,stone floor etc.

Introduction:

Resin bond diamond grinding plates are used on floor grinding machines to polishing concrete,

terrazzo and stone floor. The HTC plugging design makes the installation very easy and convenient.

 

Features:

1. Stable performance and long lifespan.

2. Suitable for EZ-change system of HTC grinding head,very easy and convenient.

 

Specifications:

The followings are the normal specifications of our resin bond diamond grinding plates:

Product Name

Segment Material

Segment Shape

Segment No.

Grit

Applications

HTC Resin Bond 

Diamond Grinding

Plate/Block

Resin 

Diamond 


Cylinder

5

50#, 100#, 200#,

400#, 800#, 1500#,

3000#

Concrete

Terrazzo

Stone Floor


The above specifications are for reference, other specifications can be ordered by customers.

Fujian Nan’an Boreway Machinery Co., Ltd.

Tel:008618650679939

Contact Person:boreway-02

PDF Show:PDF

Send Inquiry
captcha